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Absolute Maximum Ratings (T A = 25°C unless otherwise specified)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
T OPR
T STG
T SOL-I
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron) (2,3,4)
Rating
-40 to +100
-40 to +100
240 for 5 sec
Units
°C
°C
°C
T SOL-F
Soldering Temperature
(Flow) (2,3)
260 for 10 sec
°C
I F
V R
P D
Continuous Forward Current
Reverse Voltage
Power Dissipation (1)
50
5
100
mA
V
mW
Notes:
1. Derate power dissipation linearly 1.33mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16" (1.6mm) minimum from housing.
Electrical / Optical Characteristics (T A = 25°C)
Symbol Parameter
λ PE
Peak Emission Wavelength
TC λ
Temperature Coef?cient
Test Conditions
I F = 20mA
Min.
Typ.
945
0.3
Max.
Units
nm
nm / °C
2 Θ 1 /2
V F
TC VF
I R
Emission Angle
Forward Voltage
Temperature Coef?cient
Reverse Current
I F = 100mA
I F = 100mA, tp = 20ms
V R = 5V
50
-2
1.5
10
°
V
mV / °C
μA
I E
Radiant Intensity
I F = 100mA, tp = 20ms
3
7.5
12
mW/sr
TC IE
Temperature Coef?cient
-0.7
% / °C
t r
t f
C j
Rise Time
Fall Time
Junction Capacitance
I F = 100mA
V R = 0V
800
800
14
ns
ns
pF
?2002 Fairchild Semiconductor Corporation
QEE113 Rev. 1.0.1
2
www.fairchildsemi.com
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